系统 | 处理器 | 6th/7th Generation Intel® Core™Processors LGA 1151 socket for Intel® Core™ i7-6700TE, Quad Core,8M Cache,2.4GHz(3.4GHz)35W Intel® Core™ i5-6500TE, Quad Core,6M Cache,2.3GHz(3.3GHz)35W Intel® Core™ i3-6100TE,Dual Core,4M Cache,2.7GHz 35W Intel® Core™ i7-7700T,Quad Core,8M Cache,2.9GHz(3.8GHz)35W Intel® Core™ i5-7500T,Qual Core,6M Cache,2.7GHz(3.5GHz)35W Intel® Core™ i3-7101TE,Dual Core,3M Cache,3.4GHz 35W |
芯片组 | Intel®H110 Chipset Intel®Q170 Chipset |
内存 | Two 260-pin DIMM up to 32GB Dual Channel DDR4 1866/2133MHz |
BIOS | Insyde SPI 128Mbit |
图形 | 控制器 | Intel® HD Gen 9 Graphic |
显示 | 1 x HDMI 1 x VGA 1xDP |
存储 | 内部 | 1 x 2.5" SATA 3.0 Drive Bay |
扩张 | 接口 | 1 x Half-size Mini PCIe socket (PCIe/USB 2.0) 1 x M.2 M Key 2280 (Support SATA signal only) |
以太网 | 指示器 | 1 x Power LED 1 x Storage LED |
FRONT I/O | USB | 2 x USB 2.0 4 x USB 3.0 |
按钮 | 2 x USB 2.0 4 x USB 3.0 |
Wi-Fi 天线 | 2 x Antenna Hole |
REAR I/O | 以太网 | 2 x GbE (RJ-45) |
显示 | 2 x HDMI |
音频 | 1 x Line-out 1 x Mic-in |
电力 | 类型 | 12V DC in |
连接器 | DC Jack |
操作系统支持 |
| Windows 10 IoT Enterprise LTSB 64 Bit |
机构 | 材质 | SGCC + Aluminum |
支座 | Wall |
尺寸(W x H x D) | 235mm x 221.5mm x83mm(WxDxH) |
重量 | < 1Kg |
环境 | 工作温度 | -20 to 40°C |
储存温度 | -20 to 85°C |
相对湿度 | 5 to 95% RH (non-condensing) |
标准和认证 | 冲击 | Half sine wave 3G, 11ms, 3 shock per axis |
振动 | IEC68-2-64 |
认证 | CE, FCC Class A, RoHS, UL/cUL |